Call for Papers IEEE Sensors Journal Special Issue on Material-Integrated Sensing
Realizing truly intelligent materials requires endowing them with the capability to gather information about themselves and their environment, complemented by material-integrated data evaluation and ability for internal/external communications. This allows context-dependent response and thus distinguishes this class of materials from e.g. self-healing concepts, in which response is hard-wired. Currently, context-dependent capabilities are realized on a component or structural level. However, in the near- to mid-term future, material integration to a system level will become possible by trends such as component miniaturization.
This Special Issue aims to provide an overview of the current achievements along this top-down approach, towards material-integrated intelligence. It will target review articles reflecting the present state of trend setting research and defining technological fields within their scope. We also invite accompanying research papers detailing the latest developments in the field, as well as case studies describing the application of material-integrated systems.Download Call for Papers IEEE Sensors Special Issue MIS [PDF]
Other topics, clearly falling under the title of the Specal Issue, shall be considered for inclusion.
June 30th, 2013: Submission Deadline ; Sept. 30th, 2013: First Review Completed
Nov. 31st, 2013: Final Review Completed; January 2014: Publication
• Fu-Kuo Chang, Stanford University, USA
• Paul C.-P. Chao, National Ciao Tung University, TWN
• Stefan Bosse, WG Robotics, University of Bremen, GER
• Dirk Lehmhus, ISIS, University of Bremen, GER